Mike, very nice presentation in delineating the different conductor grounding methods of 250.118. Is there a possible answer defining the bonding characteristic values associated with the rated interfacing of different conductor types for surface electrical circuit conditions of Class C and Class L Bonds? The White Book does not define any requirements. Can you help in this area where dissimilar metals and plating would be better defined? I think the NEC does not set faying surface requirements either. Ben Jacks Reply to this comment |